Known as USFP, the new format supports bandwidth of 400 gigabits per second per channel while remaining compatible with existing infrastructure. The module can handle thermal dissipation of up to 100 watts without requiring a dedicated cooling circuit inside the transceiver. These features are expected to facilitate network expansion while reducing technical and energy constraints.

Nvidia and Cisco are working with TE Connectivity and Amphenol to develop connection cages, connectors and modules compatible with this format. Other partners are expected to join the collaboration to encourage adoption by data center operators. The initiative responds to the need to increase the performance of AI infrastructure without multiplying equipment or adding to its energy requirements.