Valuation: Kinsus Interconnect Technology Corp.

Market Cap 390B 11.86B 10.69B 9.87B 8.92B 16.88B 1,112B 17.3B 118B 47.16B 596B 44.49B 43.55B 1,895B P/E 2026 *
57.2x
P/E 2027 * 24.1x
Enterprise Value 398B 12.08B 10.89B 10.06B 9.09B 17.2B 1,133B 17.63B 121B 48.05B 607B 45.34B 44.37B 1,931B EV / Sales 2026 *
7.32x
EV / Sales 2027 * 4.74x
Free-Float
60.38%
Yield 2026 *
0.95%
Yield 2027 * 2.07%
1 day-0.54%
1 week-9.52%
Current month-20.49%
1 month-31.07%
3 months-11.36%
6 months+61.79%
Current year+366.04%
1 week 666
Extreme 666
787
1 month 666
Extreme 666
1,085
Current year 151.5
Extreme 151.5
1,150
1 year 126
Extreme 126
1,150
3 years 60.8
Extreme 60.8
1,150
5 years 60.8
Extreme 60.8
1,150
10 years 30.3
Extreme 30.3
1,150
Manager TitleAgeSince
Chief Executive Officer - -
Corporate Officer/Principal - 01/05/2022
Director of Finance/CFO - 01/08/2000
Director TitleAgeSince
Director/Board Member 65 01/09/2000
Chairman - 11/09/2000
Director/Board Member - -
Change 5-day change 1-year change 3-year change Capi.($)
-0.54%-9.52%+478.91%+697.63% 11.87B
+2.87%-15.95%-12.72%+259.43% 4,078B
+4.81%+4.36%+62.37%+329.98% 1,792B
+3.99%+3.94%-3.67%+260.54% 1,585B
+7.32%+14.26%+126.62%+366.23% 845B
+11.89%-5.12%+220.29%+976.57% 820B
+5.36%-8.66%+110.73%+878.54% 657B
+4.00%+8.43% - - 411B
+7.52%+3.22%+62.55%+60.83% 309B
+3.09%-0.86%+92.93%+110.48% 275B
Average +0.61%-2.79%+126.44%+437.80% 1,078B
Weighted average by Cap. -1.15%-6.61%+44.84%+367.08%

Financials

2026 *2027 *
Net sales 54.32B 1.65B 1.49B 1.37B 1.24B 2.35B 155B 2.41B 16.46B 6.56B 82.85B 6.19B 6.06B 264B 83.74B 2.54B 2.29B 2.12B 1.91B 3.62B 238B 3.71B 25.38B 10.11B 128B 9.54B 9.34B 406B
Net income 6.85B 208M 187M 173M 156M 296M 19.5B 303M 2.07B 827M 10.44B 780M 764M 33.23B 16.67B 506M 456M 421M 381M 721M 47.47B 739M 5.05B 2.01B 25.42B 1.9B 1.86B 80.91B
Net Debt 7.39B 224M 202M 187M 169M 320M 21.05B 327M 2.24B 893M 11.27B 842M 824M 35.87B 6.67B 203M 183M 169M 152M 288M 19B 296M 2.02B 806M 10.17B 760M 744M 32.38B
Projected Income Statement - Annual - Kinsus Interconnect Technology Corp.
Logo Kinsus Interconnect Technology Corp.
Kinsus Interconnect Technology Corp is a Taiwan-based company principally engaged in the manufacture and distribution of substrates and printed circuit boards (PCBs). The main products portfolio consists of plastic ball grid array (BGA) substrates, multi-chip-module (MCM) BGA substrates, chip scale package (CSP) mini-BGA substrates, high dissipation cavity down substrates and thermal enhanced-BGA (TEBGA) substrates, flip chip substrates, flip chip CSP substrates and others. Its products are raw materials or carrier components in the packaging industry and are used as chip carriers during semiconductor assembly and as channels for external circuit connections. The Company sells products domestic and foreign integrated circuit (IC) packaging, design, and system companies. The Company distributes products in Taiwan, Mainland China, the United States, Japan, Europe, and other markets.
Employees
-
Date Price Change Volume
11/11/26 TWD 741.00 -0.54% 12,649,345
10/11/26 TWD 745.00 +7.97% 8,517,090
09/11/26 TWD 690.00 +2.83% 45,091,586
06/11/26 TWD 671.00 -9.32% 15,577,678
05/11/26 TWD 740.00 -9.98% 18,032,272
Trader
Investor
Global
Quality
ESG MSCI
B
MarketScreener Ratings - Kinsus Interconnect Technology Corp.
Sell
Consensus
Buy
Mean consensus
BUY
Number of Analysts
13
Last Close Price
741.00TWD
Average target price
1,221.00TWD
Spread / Average Target
+64.78%
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