Valuation: CHPMS TCHNLGS

Market Cap 80.85B 2.54B 2.23B 2.12B 1.91B 3.6B 243B 3.65B 25.32B 9.75B 124B 9.53B 9.32B 399B P/E 2026 *
24.6x
P/E 2027 * 17.3x
Enterprise Value 85.71B 2.69B 2.37B 2.24B 2.03B 3.82B 258B 3.87B 26.85B 10.33B 132B 10.1B 9.88B 423B EV / Sales 2026 *
2.83x
EV / Sales 2027 * 2.52x
Free-Float
77.34%
Yield 2026 *
1.92%
Yield 2027 * 3.08%
Manager TitleAgeSince
Chief Executive Officer 67 17/07/1997
Director of Finance/CFO 54 01/10/2017
Chief Operating Officer - 06/03/2012
Director TitleAgeSince
Chairman 67 17/07/1997
Director/Board Member 69 28/06/2007
Director/Board Member 70 17/06/2013
Change 5-day change 1-year change 3-year change Capi.($)
-0.10%+6.13%+89.61%+186.74% 696B
+1.44%+6.91%+145.34%+424.13% 411B
-0.12%+7.80%+149.77%+269.36% 406B
-0.81%+3.76%+80.73%+325.00% 254B
+6.47%+16.65%+143.70%+211.69% 171B
+9.78%+13.76%+156.29%+774.45% 158B
+2.33%+1.44%+328.66%+542.01% 97B
-2.07%-7.81%+36.17%+244.62% 66.64B
-0.52%+3.02%+191.27%+299.07% 62.68B
Average +2.15%+4.42%+146.84%+364.12% 258.09B
Weighted average by Cap. +1.67%+5.98%+128.72%+319.63%

Financials

2026 *2027 *
Net sales 30.3B 951M 837M 793M 716M 1.35B 91.15B 1.37B 9.49B 3.65B 46.6B 3.57B 3.49B 149B 35.27B 1.11B 974M 923M 834M 1.57B 106B 1.59B 11.05B 4.25B 54.24B 4.16B 4.06B 174B
Net income 3.28B 103M 90.62M 85.86M 77.52M 146M 9.87B 148M 1.03B 395M 5.04B 386M 378M 16.17B 4.7B 147M 130M 123M 111M 209M 14.13B 212M 1.47B 566M 7.22B 553M 541M 23.16B
Net Debt 4.86B 153M 134M 127M 115M 217M 14.63B 219M 1.52B 586M 7.48B 573M 561M 23.99B 8.02B 252M 222M 210M 189M 357M 24.12B 362M 2.51B 966M 12.33B 945M 924M 39.54B
Logo CHPMS TCHNLGS
ChipMOS Technologies Inc is a Taiwan-based company mainly engaged in the integrated circuits (IC) packaging and testing business. The company's major products and services include multi-chip packaging, thin small-outline packages (TSOP), ball grid array (BGA) packaging and chip on film (COF) packaging services, as well as wafer bumping, wafer-level chip-size packaging, and wafer-overpackaging technologies. The Company's packaged and tested products are mainly used in automotive, information, communication, mobile phone, wearable and consumer electronics related products. The Company also provides customers with full-stage processing and distribution services. The Company mainly operates its businesses within domestic market and overseas markets, including the rest of Asia and the Americas.
Employees
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Trader
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Global
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Quality
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ESG MSCI
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