APIC YAMADA CORPORATION Stock

6300

JP3122520004

Semiconductor Equipment & Testing

Managers and Directors: APIC YAMADA CORPORATION

Manager	Title	Age	Since
Yasuhisa Miyata PSD	President	-	-

Director	Title	Age	Since
Hirohito Oshimori BRD	Director/Board Member	65	01/06/2010
Yasuhisa Miyata BRD	Director/Board Member	-	-

More insiders

Semiconductor Machinery Manufacturing

Add to a list 0 selected To use this feature you must be a member Log in Sign up	Change	5-day change	1-year change	3-year change	Capi.($)
APIC YAMADA CORPORATION	-0.18%	-.--%	-	-	0
APPLIED MATERIALS, INC.	+2.89%	-12.35%	+192.58%	+308.76%	453B
NAURA TECHNOLOGY GROUP CO., LTD.	-0.50%	-14.22%	+140.24%	+279.86%	85.58B
ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA	+0.70%	-8.44%	+241.61%	+322.07%	58.91B
ASM INTERNATIONAL N.V.	-0.76%	-10.39%	+72.91%	+138.97%	49.59B
DISCO CORPORATION	+4.40%	-7.17%	+72.80%	+216.76%	45.5B
GLOBALFOUNDRIES, INC.	+3.24%	-11.99%	+63.15%	+8.68%	37.3B
ACM RESEARCH (SHANGHAI), INC.	+4.67%	+2.47%	+266.64%	+280.18%	29.41B
SHENZHEN HAN'S CNC TECHNOLOGY CO., LTD.	-6.72%	-16.62%	+568.37%	+693.73%	20.88B
BE SEMICONDUCTOR INDUSTRIES N.V.	-0.25%	-14.31%	+97.46%	+150.26%	21.78B
Average	+0.77%	-8.70%	+190.64%	+266.58%	89.1B
Weighted average by Cap.	+1.98%	-15.91%	+180.30%	+281.64%

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APIC YAMADA CORPORATION is a Japan-based company mainly engaged in the manufacture and sale of electronic component assembly equipment and electronic components. The Company operates in three business segments. The Electronic Component Assembly segment provides molding equipment, molded dies, lead-processing machinery and test handlers. The Electronic Component segment provides lead frames, LED pre-molded board (LPS) and electronic telecommunications parts. The Others segment provides lead-processing dies and lead frame dies.

Employees

Sector

Semiconductor Equipment & Testing

More about the company